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NI (formerly AWR Corp.) announces that AWR Connected™ for AMCAD will be on display at the International Microwave Symposium 2015 (IMS 2015), May 18 to 22, in Phoenix in NI Booth #2431. AWR Connected for AMCAD provides ready access between NI AWR Design Environment™ V12 software and AMCAD Engineering stability analysis (STAN) software.
Diamond Microwave, a specialist in high performance microwave power amplifiers, has re-designed its range of GaN-based solid-state power amplifiers (SSPA) into a new common module format, and has added a new X-band model that can be operated in either pulsed or CW mode.
Cree, Inc. announced that Cree's wholly owned Power and RF subsidiary has submitted a draft registration statement on a confidential basis to the U.S. Securities and Exchange Commission for a potential initial public offering of the subsidiary’s Class A common stock.
WIN Semiconductors Corp., the world’s largest pure-play compound semiconductor foundry, announced that it has surpassed 1 million cumulative wafer shipments to customers in the mobile PA, Wi-Fi, wireless infrastructure and optical markets.
Beijing Just Top Network Communications Co Ltd. has awarded a new contract to Airbus Defence and Space covering the support and maintenance of the Beijing Government Shared Tetra Network, which has been in operation since 2003. This three-year contract includes services such as on-site and emergency support, software maintenance, hardware repair and a help desk.
Marki Microwave is proud to announce the release of MMIC mixers and amplifiers at the International Microwave Symposium in Phoenix. After several years of intensive development, the new GaAs Schottky MMIC mixers serve as an outstanding low cost and high performance complement to Marki's existing band ofdouble balanced Microlithic® mixers. Between these two products lines, Marki has every RF and LO frequency from 1.5 to 67 GHz covered with some type of chip scale form factor design.
Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs), will exhibit in booth #1135 at the IEEE MTT International Microwave Symposium (IMS) 2015, which will be held in conjunction with the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium and the ARFTG Microwave Measurement Conference.