RF & Microwave Industry News

RSS

Narda Safety Test Solutionshas launched the new EHP-50F FFT analyzer for low frequency electromagnetic fields.

APEI of Fayetteville, Ark., a world leader in wide bandgap packaging and design, announced that it finalized a global distribution agreement with Richardson Electronics, Ltd. Richardson Electronics is a global provider of engineered solutions and a leading distributor of electronic components. This agreement will support the expansion of APEI’s products into new markets and applications as the demand for wide bandgap products continues to accelerate.

Mini-Circuits’ ZN8PD-362HP+ 8-way 0° splitter/combiner provides power handling up to 100 W as a splitter with 1.0 dB typical insertion loss (above 9.0 dB theoretical loss) for a wide range of applications from 600 to 3600 MHz.

The Georgia Institute of Technology announced the hiring of Dr. Andrew Gerber as the new director of the Georgia Tech Research Institute and senior vice president of Georgia Tech.

W. L. Gore & Associates introduces GORE® Ethernet Cables to meet the civil aerospace industry’s emerging need for higher data rate cables in a lightweight, flexible and routable package. Engineered for the demands of modern airborne digital networks, GORE® Ethernet Cables provide high-speed data transmission up to 10 gigabits over longer distances.

Link Microtek has been appointed as UK and Ireland service centre for the range of satellite communications equipment produced by US manufacturer L-3 Narda-MITEQ.

DelfMEMS announced that its twelve throw, RF-MEMS ohmic contact switch design has just passed the one billion test cycles milestone and is still going strong.

Infineon Technologies is working with Google’s Advanced Technology and Projects group (ATAP) to develop a sensing solution. Potential applications include wearables, IoT and automotive applications.

Keysight Technologies Inc. demonstrated the Advanced Design System (ADS) Electro-Thermal Simulator at the IEEE MTT-S International Microwave Symposium (IMS) 2015, Booth 739, Phoenix, May 17-22. The solution provides accurate, temperature aware IC simulation results by using device temperatures that take into account thermal coupling and thermal characteristics of the RFIC/MMIC component packaging.

Sivers IMA and East Coast Microwave have signed a reseller and distributor agreement for the US and Canadian markets.