RF & Microwave Industry News

Remcom announces update to Wireless InSite EM Propagation software

Remcom announces a new version of Wireless InSite®, its site-specific radio propagation software for the analysis of wireless communication systems. This version, Release 2.8, supports the import of KMZ and COLLADA geometry files. It also provides several other enhancements, including significant speed improvements to the processing of terrain and city geometry, enabling simulations that include larger or more complex urban scenes.


Read More

Cobham receives $51M in orders for F-35 Lightning II

Cobham recently received a series of orders from BAE Systems for microelectronic products totaling approximately $51M for the F-35 Lightning II platform. The work will be performed by Cobham Microelectronic Solutions, a business unit of the Cobham Advanced Electronics Solutions sector.


Read More

EDI CON China and EMC Conference and Exhibition to co-locate in 2016

Horizon House Publications and China Electrotechnical Society sign partnership agreement

EDI CON China is pleased to announce that the China Electrotechnical Society’s (CES) Electromagnetic Technology Conference & Exhibition (EMC) will be co-located on the 4th floor of the China National Convention Center (CNCC) taking place 19 to 21 April, 2016 in Beijing. The combined event forms the largest microwave, EMC/EMI and high-speed digital design conference and exhibition in Beijing. 


Read More

Skyworks enables revolutionary networking platform from TP-LINK

Skyworks Solutions Inc. an innovator of high performance analog semiconductors connecting people, places and things, announced that TP-LINK's newest router OnHub is being enabled by semiconductor content from Skyworks. The product leverages more than 20 Skyworks solutions to power multiple radios and 13 fully integrated antennas across various standards including Bluetooth® 4.0, ZigBee®/Thread, 2 and 5 GHz applications for 802.11ac/b/g/n and Google's Weave. 


Read More

Mentor Graphics announces new 3D Solution, major productivity improvements

Mentor Graphics Corp. announced new PADS® 3D tool capabilities plus major usability enhancements to the PADS flow for printed circuit board (PCB) design. The new technology provides visualization, placement, and design rule checking in 3D, minimizing iterations with mechanical and manufacturing teams. Schematic design and layout enhancements improve usability across the flow for increased user productivity.


Read More