RF & Microwave Industry News

RSS

M/A-COM Technology Solutions Inc., a leading supplier of high-performance analog RF, microwave, millimeter wave and photonic semiconductor products, today announced the availability of its complete chipset for CWDM and PSM4 applications in the datacenter. The chipset includes the complete lineup of electronic and optical Integrated Circuits (ICs) to achieve the lowest power consumption in a QSFP28 form factor.

NI and Astronics Test Systems Inc., a wholly owned subsidiary of Astronics Corp. announced their collaborative efforts to deliver PXI-based products designed for the aerospace and defense community. The combination of Astronics’ strength in test system integration and NI’s leadership in PXI-based automated test systems is expected to produce a best-in-class portfolio for automated test equipment (ATE) applications.

Silicon Labs introduced a new family of multi-channel digital isolators featuring a high-voltage isolation barrier designed to withstand 10 kV surge hits. The new Si86xxxT digital isolator family provides robust protection against secondary lightning strikes and increases system reliability in a wide range of demanding industrial applications.

ON Semiconductor has expanded its wireless portfolio to include high performance, low power consumption, sub 1 gigahertz (GHz) RF devices through the acquisition of AXSEM AG. The devices enable wireless connectivity and support advanced functionality in the IoT, automatic meter reading, home automation, sensor networks and satellite communication markets.

AEM, an industry leader in high reliability component solutions, will be showcasing their high-reliability ITAR-free fuses at Space Tech Expo Europe, November 17-19 in Bremen, Germany.

Pasternack Enterprises Inc., a leading provider of RF, microwave and millimeter wave products, has signed an agreement with Ducommun Inc., to private-label manufacture select Ducommun RF products under the Pasternack brand. This new partnership provides customers with urgent RF product needs access to a greater offering of industry-leading components through Pasternack with 24/7 sales support, online purchasing and same-day shipping.

3D Glass Solutions, a leader in glass-based systems integration for electronic packaging, is proud to announce the addition of Kirby Jefferson to its board of advisors. Jefferson joins 3D Glass Solutions after spending the last 35 years with Intel Corp. in the applied technology and high-tech manufacturing industries.

The U.S. Navy has awarded Northrop Grumman Corp. a $95 million contract for low-rate initial production of the Joint Counter Radio-Controlled Improvised Explosive Device (RCIED) Electronic Warfare (JCREW) Increment 1 Block 1 (I1B1).

WIN Semiconductors Corp., the world’s largest pure-play compound semiconductor foundry,announced the expansion of its GaN technology portfolio with addition of the NP45 gallium nitride on silicon carbide process. NP45 is a 0.45μm-gate MMIC technology enabling users to design fully integrated amplifier products as well as custom discrete transistors, and has been optimized for use in 4G macro-cell base station power amplifiers operating at 2.7 GHz and above where bandwidth and linearity performance are key differentiators.

NTT DOCOMO INC. announced an agreement with Telefonica Brasil S.A to launch an eSIM, which will enable M2M devices to work on the operator’s network.