RF & Microwave Industry News

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NXP Semiconductors™ N.V., a worldwide leader in advanced systems solutions for the world’s new virtualized networks, and Bell Labs, the industrial research division of Nokia, announced they are the first to create and demonstrate a universal access device that can be used to combine wireline and wireless access support. The device is capable of supporting wireline (cable, DSL/copper) and wireless (LTE, 5G) standards with a single modem.

Janine Love joins Horizon House Publications as event director, working on EDI CON in the US and China.

Keysight Technologies Inc. announced the newest release of its industry-leading device modeling and characterization software suite: Integrated Circuits Characterization and Analysis Program (IC-CAP) 2016, Model Builder Program (MBP) 2016, and Model Quality Assurance (MQA) 2016. The software release provides designers characterizing and modeling semiconductor devices with further advances in modeling and characterization efficiency.

Qorvo^®, a leading provider of core technologies and RF solutions for mobile, infrastructure and defense applications, announced that Qorvo has been selected by a leading global smartphone manufacturer to expand its support of a marquee Android^® smartphone platform launching in the current quarter. Qorvo has broadly expanded its participation in this highly anticipated device to include RF Fusion™ RF front end modules, diversity receive modules, power amplifier duplexers (PADs), switches, impedance tuners, low noise amplifiers (LNAs), duplexers and filters.

M/A-COM Technology Solutions Inc., a leading supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, announced its highly-anticipated MAGb series of GaN power transistors for use in wireless macro basestations. Leveraging MACOM’s Gen4 GaN technology, the new MAGb series is the industry’s first commercial basestation-optimized family of GaN transistors to achieve leadership efficiency, bandwidth and power gain with a linearity and cost structure like LDMOS, and a path to better than LDMOS cost at scaled volume production levels.

Skyworks Solutions, Inc., an innovator of high performance analog semiconductors connecting people, places and things, launched SkyBlue™, a new and revolutionary enabling technology that enhances both the power capability and efficiency in LTE amplifiers and front-end solutions. Designs utilizing SkyBlue™ technology not only deliver twice the power of envelope and average power tracking systems available on the market today, but across much broader power ranges. 

NXP Semiconductors N.V., a worldwide leader in the cellular infrastructure market, announced the strategic alignment following the merger of NXP and Freescale of comprehensive products and technologies to meet the complete system challenges of 5G. NXP’s comprehensive portfolio of low and high power RF technologies are being combined to address 5G demands of bandwidth, linearity, power-efficiency and small form factor solutions.

Qorvo® Inc., a leading provider of core technologies and RF solutions for mobile, infrastructure and defense applications, announced Qorvo has joined 3GPP™ as a guest delegate to assist in the development of key aspects of 5G next-generation wireless communications standards.

Fairview Microwave Inc., a supplier of on-demand microwave and RF components, debuts a new family of semi-rigid test probes operating up to 6 GHz. Designed to assist in testing microwave circuits, these test probes are constructed of high quality semi-rigid coax and SMA female connectors.

NXP Semiconductors has introduced the MMZ25332B4 InGaP HBT linear amplifier, particularly for where thermal sensitivity is high.