RF & Microwave Industry News

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IXYS Corp., a leader in power semiconductors, mixed-signal and digital ICs for power conversion and motion control applications, announced the introduction of the IXRFD630 and IXRFD631 High Power RF MOSFET Drivers by its IXYS Colorado division. These drivers succeed the DEIC420 and DEIC421 and represent the next generation of RF driver for many RF applications including 13.56 and 27.12 Mhz RF power.

Astronomers using the new Atacama Large Millimeter/submillimeter Array (ALMA) have imaged a region around a young star where dust particles can grow by clumping together. This is the first time that such a dust trap has been clearly observed and modelled. It solves a long-standing mystery about how dust particles in discs grow to larger sizes so that they can eventually form comets, planets and other rocky bodies. The results are published in the journal Science on 7 June 2013.

ITT Exelis has been awarded a contract valued at more than $125 million by Naval Air Systems Command in Patuxent River, MD, to deliver the latest variant of the AN/ALQ-214 airborne jammer.

Precision Devices Inc., a member of the Avrio Technology Group, has appointed Dimac as a pan-European distributor of its Hi-Rel frequency control products.

mimoOn GmbH and Tektelic Communications demonstrated a complete LTE small cell base station at the Small Cell World Summit in London, UK from 4-6 June.

Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal ICs, has signed a definitive agreement to acquire Energy Micro AS based in Oslo, Norway, the late-stage privately held company that offers a power-efficient portfolio of 32-bit microcontrollers and is developing multi-protocol wireless RF solutions.

When the terms of a military contract required drop-in replacements for an obsolete RF transmitter-amplifier Amplifier Technology reverse engineered the 25 year old technology and developed a 21st Century version that the customer could use with its existing battlefield radios.

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductor industry, announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.

M/A-COM Technology Solutions Inc. (MACOM), a leading supplier of high performance analog semiconductor solutions, introduced a new Broadband Sub-Harmonic Pumped Mixer for cost sensitive applications covering the 14-32 GHz frequency range and IF frequencies from DC-7 GHz.

United Monolithic Semiconductors (UMS) announced the frequency band of the CHA3801-QDG LNA has been increased from 1.25 to 1.75GHz to 1 to 2GHz.