RF & Microwave Industry News

Components

Components Amplitude and Phased-matched SP4T Switch The model SWN-1170-4DR-STANDARD options 0418, pulse amplitude modulation, simultaneous sample and hold is an SP4T switch with an amplitude of +/-0.45 dB and phase variation of +/-2.5° between ports from 0.4 to 18 GHz. Insertion loss is < 2.75 dB, SWR is 1.75...
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Amplifiers

Amplifiers CDMA PCS Amplifiers The CDMA PCS amplifier series provides wireless infrastructure manufacturers with a cost-effective, flexible solution for their amplifier requirements. Models are available with linearized CDMA output power levels of 5, 10 and 20 W. All models comply with J-STD-008 and IS-95 spectral mask requirements over all...
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Antennas

Antennas Dual-reflector Earth Station Antenna This dual-reflector earth station antenna (ESA) supplies good performance for high density data, voice communications networks and broadcast applications. The antenna's dual-reflector Gregorian optical system gives high gain and closely controlled pattern characteristics. Available in C- or Ku-band capabilities, the 6.5-m ESA includes a...
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Device

Device GaAs Flip-chip Mixer Diode The model DMK8001 GaAs flip-chip mixer diode is a single chip designed in a series pair configuration suitable for both flip-chip mounting or wire bonding. The DMK8001 offers low capacitance, low resistance and low mixer conversion loss and can be used in the mm-wave...
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Integrated Circuits

Integrated Circuits Dual-frequency Synthesizer The model ACS2301 dual-frequency synthesizer is designed to support cable modem, set-top box, television and cable telephony tuner applications and is equipped with two fully programmable RF dividers at 2.0 and 1.1 GHz. Manufactured using the CMOS process, the ACS2301 operates from 0.4 to 2.0...
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Processing Equipment

Processing Equipment Ball Bonder The model CBT 6000™ ball bonder has the ability to bond an entire wafer at a time and offers a suite of WsCSP tools designed to meet the needs of the WsCSP market. The CBT 6000 features high wire capacity, specialized wafer programming tools, wafer...
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Service

Service Foundry Process The NASTEE (no added steps tunneling electrical erasable) process is a unique embedded capability that increases the flexibility of trimmed components produced with its 0.5 mm mixed-signal process. NASTEE replaces and improves traditional masking and laser-trimming techniques used to fine-tune analog and mixed-signal circuits. Using fewer...
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Software

Software Real-time Multiprocessing Application Solution The IXZtools 5.0 software solution for real-time multiprocessing applications provides extensive development and run-time support for the IXZ family SHARC®-based virtual machine environment boards, enabling efficient development and integration within tight time-to-market constraints. The company's integrated digital signal processing (DSP) software tool set has...
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Sources

Sources Second-generation Integrated Circuit VCXOs and TCXOs The 2GIC second-generation integrated circuit voltage-controlled crystal oscillators (VCXO) and temperature-compensated crystal oscillators (TCXO) offer CMOS- and TTL-compatible output waveforms and enable subminiature SMT packaging. Other features of the high performance IC include integrated automatic gain control (which ensures oscillator startup over...
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