RF & Microwave Industry News

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Due to the fast development of wireless communications, a low cost, high performance, highly integrated technology is needed for system-on-a-chip (SoC) implementations. The CMOS technology provides a good solution for SoC integration. 1 Recent improvements of the standard CMOS process make it possible to implement RF blocks, such as...

In Part I of this article, 1 a number of experimental results were presented, suggesting that interactions in arrays of tag antennas play an important role in determining when a UHF RFID tag can be read, even when no other scattering is present in the environment. How can these...

Up until a few years ago, it was only possible to fabricate radio frequency power amplifiers (RFPA) in the VHF band by using bipolar transistors, because the devices designed in vertical MOS technology (VMOS), which were the only MOS power devices available at that time, were not able to...

With the ever-increasing complexity in today’s high frequency and high speed circuit designs, designers appreciate the development time and cost savings that can come from accounting for electromagnetic (EM) effects up-front in designs. However, many designers still see EM point tools as an expensive luxury that is best left...

RF Amplifier Systems and Modules This redesigned web site features a new search tool that allows users to search by keyword, power, power option and/or frequency. AR Worldwide Modular RF manufactures RF amplifier systems and modules for wireless communications, military communications, and a variety of medical, scientific and industrial...

RF Power MOSFET The model ARF475FL is a high voltage, flangeless packaged, RF power MOSFET that utilizes a newly-patented process and finer geometry to deliver high peak power and RF gain. These MOSFETs operate reliably at DC voltages up to 165 V. The ARF475FL utilizes two die, configured for...

Capabilities Brochure This brochure highlights the company’s design, development and manufacture of custom microwave hybrid circuits on ceramic, quartz, AlN, BeO, ferrite and glass. The hybrid circuits encompass resistor and conductor layers, plated-through holes, solid filled vias, multilayer circuits, air bridges and snapstrates. Bandwidth Semiconductor LLC, Hudson, NH (603)...

Microwave Devices, Circuits and Subsystems for Communications Engineering A. Glover, S.R. Pennock and P.R. Shepherd, Editors John Wiley & Sons Ltd. • 549 pages; $119.95 This book originated from a master’s degree course in RF communications engineering offered by the University of Bradford, UK. As such, it reads like...

ADC and Andrew Corp. announced that they have entered into a definitive merger agreement to create a global leader in wireline and wireless network infrastructure solutions. The transaction, which was approved by the boards of directors of both companies, will build upon the complementary strengths of each company to...

Cadence Design Systems Inc. announced the formation of the Power Forward Initiative to address obstacles to lower power IC design facing the electronics industry. Members of the Initiative include Advanced Micro Devices , Applied Materials Inc. , ARM , ATI Technologies Inc. , Cadence Design Systems Inc., Freescale Semiconductor...