RF & Microwave Industry News

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WIN Semiconductors Corp., the world’s largest pure-play compound semiconductor foundry, announced the expansion of its market leading technology portfolio with the addition of a high voltage integrated passive device process. The IP3M process is a flexible passive circuit platform that provides three metal interconnect layers and high breakdown voltage capacitors needed to support reliable operation at 50 volts.

Bliley Technologies, a leader in high performance frequency control devices, announced the world's lowest power ovenized oscillator, the LP102 OCXO. Offering exceptional stability and phase noise performance in a product that consumes only 135 mW, the LP102 represents a major innovation in the frequency control industry.

Broadcom Ltd., a leading designer, developer and global supplier of a broad range of analog and digital semiconductor connectivity solutions, announced the industry’s first 60GHz wireless mesh (60G WiMesh) chipset solution designed for wireless infrastructure applications including mobile backhaul and wireless access points.

Anritsu Co. (Booth #949) will showcase its high-frequency test solutions that address the complex challenges associated with emerging microwave and millimeter wave (mmWave) designs, such as automotive radar and 5G, at IMS2016.

Cobham will exhibit at the Institute of Electrical and Electronics Engineers (IEEE) Microwave Theory & Techniques Society (MTT-S) International Microwave Symposium (IMS) during 22-27 May 2016 at the Moscone Center in San Francisco, Calif.

WIN Semiconductors Corp., the world’s largest pure-play compound semiconductor foundry, announced it has started commercial 150-mm GaAs wafer production at its third factory location, Fab C.

Smiths Microwave Subsystems  announced the release of the TRAK X-Band Surface Mount (SMT) Circulator. This device is a low-cost, true SMT circulator compatible with tape-and-reel (pick-and-place) and standard solder reflow profiles.

Analog Devices Inc. (ADI) unveiled the RadioVerse™ technology and design ecosystem, which provides customers with integrated transceiver technologies, a robust design environment, and market-specific technical expertise to move their radio designs from concept to creation quickly. 

Southwest Microwave Inc., a leading global supplier of high performance interconnect solutions will be showcasing an exciting array of End Launch Connectors to 110 GHz and SuperMini Board-to-Board DC to 67 GHz RF/millimeter wave blind-mate connectors at IMS 2016 Booth 2239.

Smiths Microwave Subsystems is pleased to announce that Millitech, the leader in millimeter-wave technology, will be reviewing a number of their latest and most advanced millimeter-wave assemblies (MMWAs) at the International Microwave Symposium (IMS) May 24-26 in San Francisco, Calif., in Booth #930. Responding to growing demands for E-, W-, and V-band products, the company has engineered assemblies with new levels of performance and integration.