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THE BOOK END Flip Chip Technologies John H. Lau McGraw-Hill 565 pages; $89 ISBN: 0-07-036609-8 Of the three popular chip-level connection technologies, flip chip provides the highest packaging density and performance, and the lowest packaging profile. Unfortunately, it is also the least understood. This book deals with classical solder-bumped...

PRODUCT FEATURE A DUAL-BAND ANTENNA COUPLER FOR CELLULAR AND PCS APPLICATIONS REACTEL INC. Gaithersburg, MD In today's fast-growing cellular phone systems throughout the world the amount of congestion, especially in urban areas, is becoming a significant issue. Major system providers are scrambling to find adequate solutions to the problem....

PRODUCT FEATURE A SINGLE CABLE FOR BASE STATION MAIN FEEDER AND JUMPER APPLICATIONS ANDREW CORP. Orland Park, IL Wireless communications rely on coaxial cable transmission lines to link tower-mounted antennas to base station radio equipment. The traditional way to form this link is to use a main feeder cable...

COVER FEATURE HIGH PERFORMANCE, LOW COST, SURFACE-MOUNT QUADRATURE COUPLERS BLUE CELL TECHNOLOGY, A FAMILY MEMBER OF MINI-CIRCUITS Brooklyn, NY As system requirements increase, the demands placed on passive components also continue to rise in an effort to meet ever-increasing consumer demands. Industry is demanding higher performance in smaller footprints...

PRODUCT FEATURE A DUPLEXER, COMBINER AND DISTRIBUTION AMPLIFIER FOR WIRELESS APPLICATIONS FSY MICROWAVE INC. Columbia, MD Today's wireless base stations operate in a duplex mode and require a duplexer at the antenna to provide low insertion loss and high power capabilities in the transmit mode and low noise amplification...

PRODUCT FEATURE BROADBAND DC TO 4 GHZ DIGITAL ATTENUATORS WITH HIGH ACCURACY HITTITE MICROWAVE CORP. Chelmsford, MA Control of signal strength while maintaining signal integrity in the transmit and receive paths of wireless systems has always been a concern of RF design engineers. A family of seven low cost...

TECHNICAL FEATURE HARMONIC TUNING OF POWER TRANSISTORS BY ACTIVE LOAD-PULL MEASUREMENT Abstract: A nonlinear network analyzer combined with an active multiharmonic load-pull system is described. Data acquisition uses an HP 71500 microwave transition analyzer (MTA) and force/sense bias supplies. Complete tuning and monitoring of the incoming and outgoing signals...

TECHNICAL FEATURE THERMAL DESIGN CONSIDERATIONS FOR WIDE BANDGAP TRANSISTORS Abstract: The peak junction temperature of a transistor is an important factor in determining its lifetime and output power degradation over time. Many design parameters determine the temperature rise in the semiconductor, including the transistor performance, semiconductor material and device...

TECHNICAL FEATURE HIGH POWER RF LDMOS TRANSISTORS FOR AVIONICS APPLICATIONS Abstract: This article describes the inherent advantages of using laterally diffused metal oxide semiconductor (LDMOS) amplifiers in high power avionics transponder applications. In comparing this technology to bipolars, key device features such as gain, linearity, switching, thermal issues and...

TECHNICAL FEATURE SIMULATION OF INTERDIGITATED STRUCTURES USING TWO-COUPLED-LINE MODELS Abstract: Some commercial microwave CAD programs do not incorporate models for more than three coupled lines. This fact is especially critical in the design and analysis of multiple-line planar structures, such as interdigital, combline and hairpin filters, meander lines, spiral...