RF & Microwave Industry News

RSS

 M/A-COM Technology Solutions Inc., a leading supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, announced its new MAAM-011169 12V CATV push-pull infrastructure amplifier designed to meet DOCSIS 3.1 and C-DOCSIS standards. Targeted at hybrid fiber-coaxial (HFC) network amplifiers and FTTP ONTs, the new MAAM-011169 MMIC amplifier delivers high output power, gain and linearity with low power dissipation. 

 ViaSat Inc., a global broadband services and technology company, announced it entered into a new technical agreement withThe Boeing Company. The agreement initiates the evaluation process for airlines to specify installation of the ViaSat in-flight Wi-Fi® connectivity system on Boeing Commercial airplanes. 

Keysight Technologies Inc. introduced a wireless power transfer analysis option for its E5072A, E5061B, and E5063A ENA series network analyzers. With this software option, the ENA Series network analyzers are now able to effectively address the needs of emerging wireless power transfer (WPT) markets.

Sivers IMA announced that it is strengthening its sales organization in order to better serve its global customers and partners in time for the launch of new products.

NI (formerly AWR Corp. announces that NI AWR Design Environment™ V12’s new load pull features for power amplifier design will be the topic of a paper given by Chris Bean of AWR Group, NI at the Topical Symposium on Power Amplifiers for Wireless Communications being held September 21-22, 2015 in San Diego.

e2v has moved to new offices in Chaoyang District, Beijing.

Innovative Integration, a trusted supplier of signal processing and data acquisition hardware and software solutions, has expanded it's presence into the PXI/Instrumentation market with the addition of the PXIe-XMC Adapter.

Remcom announces the integration of XFdtd® Electromagnetic Simulation Software and Optenni Lab™ matching circuit optimization software. The Optenni addition enables XFdtd users to more easily generate a matching network topology and initial component values for their device. Once the topology is chosen and physically laid out on the PCB, XFdtd’s Circuit Element Optimizer completes the matching network design process by determining the optimal component values using full wave FDTD simulation, taking electromagnetic phenomena, such as coupling, into account.

Knowles is pleased to announce that the new capacitor facility in Suzhou, China is fully operational. This completes the relocation of Multilayer Ceramic Capacitor (MLCC) manufacturing from plants in the UK and Mexico.

RFMW Ltd., announced design support for MECA LPTC series of Low-PIM terminations.The MECA LPTC series features compact terminations at power handling levels of 10, 50, 100 and 250 watts with outstanding PIM performance of -160 to -165 dBc. All of the terminations perform up to 2700 MHz with a maximum VSWR 1.20:1. The MECA Low-PIM terminations are available in 7/16, N and 4.1/9.5 connector configurations.