We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
Menlo Microsystems, Inc. (Menlo Micro) announced that it has joined the American Semiconductor Innovation Coalition (ASIC) in its effort to ensure that the funding provided through the historic CHIPS and Science Act will be effectively employed to advance U.S. semiconductor R&D leadership and improve the pathway from research to manufacturing.
Mercury Systems, Inc. introduced the Model 5560, its next-generation 3U OpenVPX™ SOSA™ aligned co-processing board that is the first to be powered by the AMD Xilinx Versal® HBM series with integrated high bandwidth memory.
Uhnder announced that OFilm Group has selected Uhnder’s Digital Code Modulation (DCM) technology to achieve best-in-class ADAS to advance automotive safety in China.
Researchers from IDLab (an imec research group at Ghent University and the University of Antwerp, Belgium) and Nokia Bell Labs presented the first upstream linear burst-mode transimpedance amplifier (TIA) chip that accommodates 50 Gbit/s NRZ and 100 Gbit/s PAM-4 modulation.
Filtronic plc announced the launch of Morpheus X2, the latest generation of its market-leading E-Band transceiver for carrier-grade applications in 5G backhaul, midhaul and fronthaul—collectively known as XHaul.
RSS
