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Menlo Microsystems, Inc. announced it has joined MITRE Engenuity’s Semiconductor Alliance in an effort to create a more resilient and advanced U.S. semiconductor ecosystem.
The Global mobile Suppliers Association (GSA) announced the establishment of the GSA Private Mobile Networks Special Interest Group (SIG) to bring together leading telecommunications companies wishing to track, boost and promote the Private Mobile Networks ecosystem.
Telecom Infra Project announced a new milestone for its OpenWiFi products as Boingo Wireless becomes the first TIP participant to adopt TIP OpenWiFi to enhance its Wi-Fi 6E network builds for commercial deployment.
Being part of the DOD's Dynamic Spectrum Sharing 5G Network Enhancements Program, Kumu Networks has created a prototype 5G Interference Canceling Repeater that is under evaluation for use as part of a DOD testbed at Hill Air Force Base in Utah.
W. L. Gore & Associates announced the addition of a new European distributor for its high speed data cables. A.E. Petsche Company will be a new qualified distributor.
IQE plc announced it has entered into a strategic collaboration agreement with SK siltron for the development and commercialisation of compound semiconductor products.
Amphenol RF introduced a black zinc-cobalt plating option for a variety of RF connectors and coaxial adapters to expand the versatility of existing product designs.
COMSOL announced the 2022 edition of COMSOL News, recognizing the work of academic and industry organizations around the world that use multiphysics simulation to drive innovative technological research and development.
Nokia announced that it will lead the Hexa-X-II project, the second phase of the European 6G flagship initiative, by creating the pre-standardized platform and system view that will form the basis for many inputs into future 6G standardization.
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