RF & Microwave Industry News

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MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, announced the newest entries in its MAGb series of GaN on Silicon power transistors for use in macro wireless base stations.

COMSOL, the leading provider of multiphysics modeling, simulation, and application design software, has announced support for app development that furthers work toward 5G and the IoT.

Skyworks Solutions Inc., an innovator of high performance analog semiconductors connecting people, places and things, introduced a suite of high performance amplifiers specifically addressing the rapidly growing small cell infrastructure market. 

Diamond Microwave, a specialist in high performance microwave power amplifiers, has announced the launch of a new range of X-band GaN-based pulsed solid-state power amplifiers (SSPA) offering integrated monitoring and protection.

AWR Connected™ for ANSYS now offers an integrated two-way link between ANSYS® HFSS™ and NI AWR Design Environment™, specifically Microwave Office circuit design software, enabling RF/microwave designers to seamlessly tie HFSS extracted S-parameters back into NI AWR software. This integration unites two industry-standard design tools, HFSS full-wave electromagnetic (EM) field simulation and Microwave Office, to quickly and accurately simulate microwave circuits.

IEEE's Interactive Mars Exploration Vehicle (MEV) experience will send attendees on mission to Mars at the IEEE MTT-S 2016 International Microwave Symposium (IMS) beginning Tuesday, May 24 at the Moscone Center South. As part of the symposium's Wireless Wonders Pavilion, attendees can visit booth #1800 and pilot the Mars Exploration Vehicle in an interactive virtual reality game.

Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced it will feature 15 new products from its radio frequency (RF), millimeter wave integrated circuits (ICs), monolithic microwave integrated circuits (MMICs), ultra-low power sub-GHz transceivers and high performance WLAN monolithic radio frequency integrated circuits (RFICs) portfolio at the 2016 IEEE MTT-S International Microwave Symposium (IMS2016) and Exhibition held at the Moscone Center in San Francisco, Calif., May 22-27, 2016.

Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the addition of the UltraCMOS® PE41901 image reject mixer into its growing portfolio of high frequency RF SOI products.

Thousands of attendees will convene for the IEEE MTT-S 2016 International Microwave Symposium (IMS) May 22-27 at San Francisco’s Moscone Center to discuss the latest microwave and RF advancements in emerging areas around wireless connectivity. With a theme of “the Gateway to the Wireless Future,” IMS2016 will also feature a sold-out show floor with a record-breaking 630 exhibitors from around the world debuting the latest advancements in communications, defense, wearable electronics, medical applications, virtual reality and more.

WIN Semiconductors Corp., the world’s largest pure-play compound semiconductor foundry, announced the expansion of its market leading technology portfolio with the addition of a high voltage integrated passive device process. The IP3M process is a flexible passive circuit platform that provides three metal interconnect layers and high breakdown voltage capacitors needed to support reliable operation at 50 volts.