RF & Microwave Industry News

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ThinKom has secured a major production contract for an airborne, multi-band, conformal antenna solution to support a military partner.

Quantic Wenzel announced that Gilberto “Gil” Gonzalez has joined the company as the new director of engineering.

Rohde & Schwarz, working with NVIDIA, is taking a step forward from simulations to implementing AI and ML in future 6G technology.

Lockheed Martin is partnering with the U.S. Navy to integrate hypersonic strike capability onto surface ships.

Although 6G spectrum will not be standardized till 2027 at the earliest, researchers and OEMs like Huawei are already exploring the technical advancements needed to facilitate 6G, according to IDTechEx.

IDTechEx’s new “Automotive Semiconductors 2023-2033” report focuses on the areas of automation and electrification, explaining what semiconductor technologies are needed and how their growth is going to drive a 10-year CAGR of 9.4 percent in the automotive semiconductor market.

At ISSCC, imec, presents a novel digitally calibrated charge-pump (CP) phase-locked loop (PLL) that can generate high-quality frequency-modulated continuous-wave (FMCW) signals for mmWave radars at low power consumption.

Faststream will be showcasing the features of their 5G RU platform from February 28 to March 3, in Hall 5, Stand #5D39, at the Mobile World Congress (MWC) in Barcelona.