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Rohde & Schwarz helps Tier 1 chipset manufacturers around the globe to verify 5G Reduced Capabilities (RedCap) and other 3GPP Release 17 features of their products.
TTP announced that it has integrated its satellite and systems design expertise with tools from Keysight Technologies Inc. to provide a 5G non-terrestrial network (NTN) ‘digital twin’ modelling and emulation environment.
CAES has been awarded a contract with the U.S. Navy for spares, engineering services and repairs on antenna array panel assemblies to support the SEWIP Block 2 program.
Yole Intelligence releases its brand-new RF Annual Report, RF Front-End for Mobile 2023 with aims to provide a comprehensive view of the RF front-end market from the system level down to the wafer level.
Fairview Microwave introduced an innovative series of low PIM, in-building distributed antenna system (DAS) antennas to address the most challenging low PIM requirements for 5G and LTE/4G bands.
The Dual Dissimilar technology equips an aircraft with the Plane Simple® Ku- and Ka-Band tail-mount antennas (dual) to support two different satellite constellations (dissimilar).
HENSOLDT is developing essential core elements of the novel sensor network in the German-French-Spanish armament project FCAS (future combat air system).