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Ardent Concept's patented QUICKLINK™Connector mounts directly to the PCB with a twist-to-lock footprint design that requires only two small thru holes and a gold pad for the connector to land on. QUICKLINK™ footprints can be placed anywhere on your board to allow easy access to any channels from your device without having to solder on costly SMA or SMP surface mount receptacles.
To address the need for radio systems that can adapt to changing environments on the fly and that can be easily reconfigured once in the field, BAE Systems has developed the MATRICS (Microwave Array Technology for Reconfigurable Integrated Circuits) chip.
Custom MMIC, a leading developer of performance driven monolithic microwave integrated circuits (MMICs) is pleased to announce Dr. Charles J. Trantanella, Chief Scientist at Custom MMIC, will be presenting at EDI CON USA 2016 on September 22 with his talk at 9:00 a.m. entitled, “Reaching New Heights in Mixer Linearity with GaN MMIC Technology.”
Rohde & Schwarz has successfully demonstrated the generation and analysis of 5G signals based on the characteristics as specified in the Verizon open trial specifications. The R&S SMW200A vector signal generator and the R&S FSW signal and spectrum analyzer both provide outstanding test and measurement capabilities, resulting in an EVM performance of 1 percent when applying these 5G signals.
At the Smiths Microwave Subsystems Booth #721 at the EDI CON USA 2016 show in Boston, Mass., September 20-22, Millitech will be reviewing several new millimeter wave products for varied E-, W-, and V-Band applications.
Anritsu Co., a founding member of the Open Lab Alliance (OLA), announces its Signal Analyzer MS2692A DSRC (Dedicated Short Range Communications) test solution has now been added to the portfolio of products offered at the CETECOM OLA Lab in Milpitas, Calif. The integration of the MS2692A enhances the test capability of the OLA laboratory, which has been established to accelerate the development of connected vehicle and autonomous vehicle technologies with a major focus on the DSRC V2X (vehicle-to-vehicle and vehicle-to-infrastructure) technology.
Colonial Assembly and Design LLC, a wholly-owned subsidiary of Zentech Manufacturing Inc. has received a United States Navy contract award in the amount of $37 million.
Smiths Microwave Subsystems is pleased to announce that advanced surface mount technology has led TRAK to deliver the first-ever circulator that can be used in automated assembly of phased array radar assemblies. You’ll find this product and several other microwave component and assembly innovations on display at the Smiths Microwave Subsystems Booth #721 at EDI CON USA 2016.
ON Semiconductor Corp. and Fairchild Semiconductor International Inc. jointly announced that ON Semiconductor successfully completed its previously announced $2.4 billion cash acquisition of Fairchild.
SemiGen Inc., an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, is featuring a range of products at EDI Con 2016 in Boston at Booth #505.
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Ardent Concept's patented QUICKLINK™Connector mounts directly to the PCB with a twist-to-lock footprint design that requires only two small thru holes and a gold pad for the connector to land on. QUICKLINK™ footprints can be placed anywhere on your board to allow easy access to any channels from your device without having to solder on costly SMA or SMP surface mount receptacles.
To address the need for radio systems that can adapt to changing environments on the fly and that can be easily reconfigured once in the field, BAE Systems has developed the MATRICS (Microwave Array Technology for Reconfigurable Integrated Circuits) chip.
Rohde & Schwarz has successfully demonstrated the generation and analysis of 5G signals based on the characteristics as specified in the Verizon open trial specifications. The R&S SMW200A vector signal generator and the R&S FSW signal and spectrum analyzer both provide outstanding test and measurement capabilities, resulting in an EVM performance of 1 percent when applying these 5G signals.
At the Smiths Microwave Subsystems Booth #721 at the EDI CON USA 2016 show in Boston, Mass., September 20-22, Millitech will be reviewing several new millimeter wave products for varied E-, W-, and V-Band applications.
Anritsu Co., a founding member of the Open Lab Alliance (OLA), announces its 
SemiGen Inc., an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, is featuring a range of products at EDI Con 2016 in Boston at Booth #505.