RF & Microwave Industry News

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The agenda has been set and registration opened for the sixth annual combined AWR Design Forum (ADF 2016) and NI AWR Software User Group meeting, being held during European Microwave Week (EuMW 2016) October 4-6 in London. ADF 2016 takes place on October 4 from 12:00 p.m. to 4:00 p.m. in ICC Capital Suite, Room 6 on Level 3.

ARC Technologies will be showcasing its line of RF absorbers and EMI shielding materials at the Electronic Design Innovation Conference (www.ediconusa.com) exhibition scheduled for September 20-22, 2016 at the Hynes Convention Center in Boston, Mass. Representatives from ARC Technologies will be on hand at Booth #613 to show their latest solutions for noise and interference control for the RF/microwave industry, including Hot Melt and Wave-X absorbers, as well as testing capabilities.  

MACOM Technology Solutions Inc. (MACOM) introduced two LNAs covering 18 to 31.5 GHz, with a typical noise figure of 2.5 dB, and 2 to 18 GHz, with 1.4 dB noise figure.

Rosenberger has launched what it claims to be the next generation of automotive coax connectors for high data transmissions up to 15 GHz/20 Gbps.

Huawei is helping China Mobile to deploy an indoor digital solution in the Wuxi Coastal City program’s commercial complex that is based on 4G and other telecom networks.

Cobham radiation hardened (RadHard) microelectronics were launched aboard NASA’s Origins, Spectral Interpretation, Resource Identification, Security-Regolith Explorer spacecraft.

Pickering Interfaces will showcase their broad range of PXI and LXI RF & Microwave switching solutions, along with their soon-to-be-released 2-slot USB/LXI Modular Chassis and LXI Simulation Tool at EDI CON USA 2016, Booth 822 taking place September 20-22 in Boston, Mass.

Rohde & Schwarz follows the call to London to attend European Microwave Week, where the company will demonstrate its T&M highlights for demanding applications in the aerospace & defense, automotive and wireless industries. In focus: test solutions for satellite communications, for radar applications in the A&D and automotive sectors and for the next generation of mobile networks 5G.

Modelithics Inc. and IPDiA, have teamed up to develop Modelithics models for IPDiA’s high performance ultra broadband surface mount silicon capacitor. Modelithics and IPDiA worked closely as part of the Modelithics Vendor Partner (MVP) Program to characterize the 10 nF low profile (100 µm) capacitor (UBSC 935 152 492 510).