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Smiths Microwave Subsystems is pleased to announce that advanced surface mount technology has led TRAK to deliver the first-ever circulator that can be used in automated assembly of phased array radar assemblies. You’ll find this product and several other microwave component and assembly innovations on display at the Smiths Microwave Subsystems Booth #721 at EDI CON USA 2016.
ON Semiconductor Corp. and Fairchild Semiconductor International Inc. jointly announced that ON Semiconductor successfully completed its previously announced $2.4 billion cash acquisition of Fairchild.
SemiGen Inc., an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, is featuring a range of products at EDI Con 2016 in Boston at Booth #505.
Dr. James (Jim) Komiak will be presenting the keynote for the amplifier track at the EDI CON USA conference, taking place 20-22 September in Boston. We caught up with Jim to learn more about his background and perspective on the state of MMIC design.
The agenda has been set and registration opened for the sixth annual combined AWR Design Forum (ADF 2016) and NI AWR Software User Group meeting, being held during European Microwave Week (EuMW 2016) October 4-6 in London. ADF 2016 takes place on October 4 from 12:00 p.m. to 4:00 p.m. in ICC Capital Suite, Room 6 on Level 3.
ARC Technologies will be showcasing its line of RF absorbers and EMI shielding materials at the Electronic Design Innovation Conference (www.ediconusa.com) exhibition scheduled for September 20-22, 2016 at the Hynes Convention Center in Boston, Mass. Representatives from ARC Technologies will be on hand at Booth #613 to show their latest solutions for noise and interference control for the RF/microwave industry, including Hot Melt and Wave-X absorbers, as well as testing capabilities.
MACOM Technology Solutions Inc. (MACOM) introduced two LNAs covering 18 to 31.5 GHz, with a typical noise figure of 2.5 dB, and 2 to 18 GHz, with 1.4 dB noise figure.
Sunstone Circuits,® a leading printed circuit board (PCB) solutions provider for prototypes, medium volume and production quantities, announced the addition of RF/microwave materials (high speed/low loss) for 1 and 2 layer boards.