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SCHOTT’s new lightweight microelectronic packages deliver the same reliable, long-lasting protection for avionics while lowering the weight by up to two-thirds compared to traditional electronic packaging.
IDTechEx released the "Advanced Semiconductor Packaging 2023-2033" and "Materials and Processing for Advanced Semiconductor Packaging 2024-2034," reports, encapsulating their in-depth analysis and insights into the rapidly evolving landscape of 3D semiconductor packaging.
At EuMW 2023 in Berlin, Rohde & Schwarz and IMST will showcase a solution for over-the-air measurements of electrically large beamforming antenna arrays for various satcom applications.
Pickering Interfaces will showcase its extensive range of RF and microwave switching solutions, including the first modules in a new MEMS-based RF PXI/PXIe multiplexer family, at booth #605B at EuMW.
StratEdge Corporation will present its thermally-efficient line of post-fired and molded ceramic semiconductor packages at several upcoming events including EuMW.
5G Americas white paper, "The State of Mobile Network Evolution," provides updates on global initiatives and advances in next generation wireless technologies such as full duplex, JCAS and intelligent surfaces.
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