RF & Microwave Industry News

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Mitsubishi Electric Corporation announced that it will begin shipping samples of a new GaN power amplifier module for use in 5G massive MIMO base stations.

Announcing the launch of double-ridge waveguide couplers showcasing integrated coaxial connectors for seamless transitions in various applications.

SCHOTT’s new lightweight microelectronic packages deliver the same reliable, long-lasting protection for avionics while lowering the weight by up to two-thirds compared to traditional electronic packaging.

IDTechEx released the "Advanced Semiconductor Packaging 2023-2033" and "Materials and Processing for Advanced Semiconductor Packaging 2024-2034," reports, encapsulating their in-depth analysis and insights into the rapidly evolving landscape of 3D semiconductor packaging.

At the 24th DSEI, AARONIA AG showed AARTOS drone detection system.

At EuMW 2023 in Berlin, Rohde & Schwarz and IMST will showcase a solution for over-the-air measurements of electrically large beamforming antenna arrays for various satcom applications.

GL Communications Inc. addressed the press regarding their Drive and Walk Testing solution using GL’s vMobile™ equipment.

Fairview Microwave has announced the expansion of its hermetic adapters and connectors product line. 

Pickering Interfaces will showcase its extensive range of RF and microwave switching solutions, including the first modules in a new MEMS-based RF PXI/PXIe multiplexer family, at booth #605B at EuMW.

StratEdge Corporation will present its thermally-efficient line of post-fired and molded ceramic semiconductor packages at several upcoming events including EuMW.