RF & Microwave Industry News

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Teledyne Labtech announced a major new capability allowing the embedding of layers of synthetic graphite within RF and microwave printed circuit boards.

SiTime® Corporation introduced the Elite X™ Super-TCXO® for edge networks such as data centers, 5G front haul, connected cars and industrial IoT.

The REMC26G40GD delivers up to 45 dBm of continuous wave saturated output power over a range of 26.5 to 40 GHz with 50 dB of gain.

Kymeta announced the closing of additional equity funding totaling approximately $84 million, led by Bill Gates and participation by Hanwha Systems, among other investors.

Ericsson and Vodafone have successfully completed the U.K.’s first 5G standalone (SA) network slicing trial in a joint lab demonstration to create on-demand 5G connectivity and dedicated performance for consumer and business customers.

Requtech’s latest lightweight electronically scanned antennas at Ku- and Ka-Bands, powered by Anokiwave’s satcom ICs, are delivering high performance, low-cost user terminals for satcom-on-the-move.

Teledyne e2v Semiconductors’ ultra-high density DDR4 memory flight models are now being shipped to key customers around the world and is now moving into the mass production phase, with the space-grade radiation-tolerant DDR4s being available.

Rohde & Schwarz's new R&S BBA300 family provides a single amplifier solution that eliminates the need to switch instruments or bands during a test.