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Technical Feature Two-tone vs. Single-tone Measurement of Second-order Nonlinearity Darioush Agahi, William Domino and Nooshin Vakilian Conexant Systems Inc. Newport Beach, CA This article describes how to correctly find the second-order intercept point (IP2) from one- and two-tone tests, and presents measurement results in support of the theory. Relation...
Technical Feature Fixing the Curtice FET Model Convergence difficulties are common in nonlinear analyses of circuits using a Curtice model. The problem is not the model itself, but the limitations of the parameters describing the gate I/V characteristic. In this article, we show why that failure occurs, and how...
Introduction to a new model of multi-finger heterojunction bipolar transistors used to analyze and predict current collapse, bias dependence and output power
Technical Feature Simulating Multi-finger Power HBTs A new model of multi-finger heterojunction bipolar transistors (HBT) is presented to analyze and predict current collapse, bias dependence and output power. The simulation of multi-finger HBTs has proven to be very challenging in both computer-aided design and electromagnetic (EM) simulation. However, by...
New Products COMPONENTS SP4T Switch The model AS204-80 GaAs IC SP4T switch combines high isolation to provide greater sig- nal path separation and reduced RF leakage with non-reflecting ports to eliminate the need for external terminations while providing 50 W output impedance. Covering the frequency range of DC to...
Around the Circuit INDUSTRY NEWS Advanced Power Technology Inc. (APT) has entered into a definitive agreement to acquire GHz Technology Inc. Under the terms of the agreement, APT will issue approximately 1.48 million shares of common stock and $13.3 M in exchange for the business and assets of GHz...
New Literature General Purpose Test Instruments Catalog This 64-page, full color catalog contains detailed information on more than 330 of the company's newest test and measurement products, accessories and support services that can help R&D and manufacturing test engineers. The catalog is designed to help engineers find product information...
Workshops & Courses International Workshop on Wafer Level CSP and Flip Chip Packaging Topics : Wafer level packaging materials and processes, wafer level burn-in and test, small die and memory products, ultra-high density substrate technologies for WLP, new and advanced wafer technologies, wafer package reliability. Site : Stone Mountain,...
News From Washington Engineered Support Receives $3.5 M Order for Avionics Testing System from US Navy Engineered Support Systems Inc. received a $3.5 M order from the US Navy for the production of aircraft avionics testing subsystems for Consolidated Automated Support Systems (CASS). This order, which represents a modification...
International Report Thales Wins Euro 210 Million NH90 Contract International avionics contractor Thales Avionics has been awarded a Euro 210 million contract covering the supply of avionics and electrical power system equipment into the multi- national NH 90 helicopter programme. Working with partners Diehl Avionik Systeme, Teldix, Galileo Avionica...
The Commercial Market Terrorism Attacks Accelerate Interest in GPS Applications According to Allied Business Intelligence, Global Positioning System (GPS) applications have attracted increased interest in the wake of the terrorism attacks of 2001. American society has changed from one that is casual toward these kinds of threats to one...