RF & Microwave Industry News

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MiCOM Labs Inc., has released MiTest, a hardware and cloud based computing test system that can accelerate product development release by running regulatory compliance testing in a company’s own design lab.  “MiTest provides manufacturers the ability to consolidate company-wide test processes, enabling flexible in-house compliance testing and certification possibilities for new products,” said Gordon Hurst, president and CEO for MiCOM Labs.

AEM Inc. announces a hirel-qualified Sn/Pb (tin/lead) conversion process designed to mitigate the formation of tin whiskers in surface-mount components. The AEM process eliminates potential damage to sensitive electronic devices caused by conventional hot-solder dippingwhile ensuring that converted component terminations con­tain a minimum of 5 percent Pb as verified by SEM/EDS and XRF inspection methods.

Agilent Technologies Inc. announced the latest release of Electromagnetic Professional (EMPro), its 3-D electromagnetic simulation software.

Intercept Technology Inc., a leading provider of PCB, RF, Hybrid, and high-speed CAD/CAE design software, has joined the ODB++ Solutions Alliance as a demonstration of its continued support for unified CAD/CAM vendor file formats. For over 15 years, Intercept’s Pantheon PCB layout software has offered a variety of manufacturing file formats for its user base, and Intercept remains committed to continuing to support both legacy and new file formats.

UltraSource Inc., an industry leader in delivering thin film on ceramic manufacturing solutions, will be showcasing several of its technologies at this year’s IMS 2013 held at the Washington State Convention Center in Seattle, Washington June 4-6. 

L-3 WESCAM unveiled its new land vehicle surveillance system, the MX™-LVSS, at CANSEC, Canada’s largest defence and security trade show, in the outside display area, booth 2019. Based on L-3 WESCAM’s industry-leading MXSeries of multi-spectral, highly stabilized imaging systems, the MX-LVSS is a modular and rugged solution consisting of low-risk, battle-proven, commercial-off-the-shelf subsystemscurrently operating in the world’s harshest terrains and climates.

Pole/Zero Corp. and Zeger-Abrams Inc. have recently completed an exclusive Technology Transfer and Technology Licensing Agreement covering the entirety of Zeger-Abrams technology and products including:

M/A-COM Technology Solutions Inc. (MACOM), a leading supplier of high performance analog semiconductor solutions, extended its strong industry position in diodes with a new family of broadband Shunt PIN diodes for high-power switching applications.

Auriga Microwave and Focus Microwaves, RF microwave industry market leaders, integrated their showcase systems, Auriga's AU4850 Pulsed IV/RF Characterization System and Focus' Harmonic Load-pull System to provide users unmatched measurement capabilities. Responding to market demands, Auriga and Focus have developed a software bridge to provide users harmonic pulsed load-pull measurement capability. The software will be offered by both companies through their respective sales channels.

NXP Semiconductors has launched its new Gen8+ LDMOS RF power transistors – an expansion of its eighth-generation LDMOS product line for wireless base stations with a strong focus on TD-LTE.