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Sivers Semiconductors Inc. has received a U.S.$375,000 award under the Defense Advanced Research Projects Agency (DARPA) Next-Generation Microelectronics Manufacturing (NGMM) program in collaboration with PseudolithIC Inc.
Ulrich L. Rohde was awarded the 2023 IEEE AP-S Distinguished Industry Leader Award for all of his years of hard work to develop new software and hardware that progressed the state-of-the-art to where it is today.
Yole Intelligence has combined its long expertise in semiconductors and its deep knowledge of automotive connectivity technologies and markets to deliver a first edition of the RF for connected vehicles report.
DISH Network Corporation and EchoStar Corporation announced they have entered into a definitive agreement for DISH Network to combine with EchoStar Corporation in an all-stock merger at a fixed exchange ratio.
Richardson RFPD, Inc. announced the in-stock availability and full design support capabilities for a series of RF and microwave multilayer capacitors from KYOCERA AVX.
According to a newly published forecast report by Dell’Oro Group, private wireless revenues remain small relative to total RAN investments, but year-over-year growth is on the uptick.
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