Articles Tagged with ''conference''

AWR sponsors Best Paper Award at 2013 ARMMS

AWR Corp., the innovation leader in high-frequency EDA software, announces that it will sponsor the Best Paper Award at the upcoming as well as future Automated RF & Microwave Measurement Society (ARMMS) Conferences in memory of the late AWR European business development manager Steve Evans-Pughe. The ARMMS Best Paper Award titled as “Steve Evans-Pughe Award” will honor the memory of this UK and pan-European RF and microwave industry pioneer.


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Richardson RFPD at IEEE COMCAS 2013

Richardson RFPD Inc. announces its attendance and participation at the 2013 International IEEE COMCAS. The annual conference provides a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the areas of microwaves, communications, antennas, solid state circuits, electromagnetic compatibility, electron devices, radar and electronic systems engineering.


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Coilcraft to participate in EuMW

Coilcraft Inc. will be participating in the 16th European Microwave Week, being held October 6-11 at the Nürnberg Convention Center, Nuremberg, Germany. The Coilcraft exhibit will include its broad range of wirewound component families, each providing best-in-class performance across market applications. The Exhibition portion of the event runs Tuesday, October 8th through Thursday, October 10th.


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Mini-Circuits to sponsor IEEE COMCAS 2013

Mini-Circuits is pleased to contribute to the 2013 IEEE Conference on Microwaves, Communications, Antennas, and Electronic Systems(COMCAS) as a platinum sponsor. Representatives from Mini-Circuits and MCDI, Mini-Circuits’ new distributor in Israel, will be exhibiting at Booth 31 with a showcase of its rapidly growing line of portable test equipment and other selected new products.


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Registration now open for DesignCon 2014: Where the Chip Meets the Board

Recognized throughout the high-speed communications and semiconductor communities as the premier educational conference and technology exhibition for electronic design engineers working on the cutting edge of high-speed serial design and signal and power integrity, DesignCon 2014, which will take place in Santa Clara, California, January 28-31, is now open for registration.  Hosted by UBM Tech, the daily source of essential business and technical information for the electronics industry’s decision makers, the 14-track technical DesignCon conference program will include more than 120 in-depth tutorials, technical paper sessions and panel discussions. 


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