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With its new SIPLACE CA2 hybrid placement solution, market and technology leader ASMPT combines semiconductor and SMT production in a single machine that makes it possible to integrate the production of SiPs directly into the SMT line.
Skyworks Solutions, Inc. and Sequans Communications S.A. introduced the SKY66431, a 5G massive IoT SiP solution, which combines Sequans’ Monarch 2 modem with Skyworks’ industry-leading RF front-end solution.
Mercury Systems Inc. announced it received a $14 million order from a leading defense prime contractor to provide system-in-package (SiP) assemblies for an airborne secure processing application.
Mercury Systems, Inc. announced it received a $4 million order from a leading commercial technology company for advanced Si packaging to be used in electronic warfare, AESA beamforming and C4ISR systems.
Mercury Systems, Inc announced the new RFS1140 system-in-package (SiP), a first to combine powerful state-of-the-art FPGA processing with Jariet Technologies’ high speed data converters at chip scale and manufactured in a trusted U.S. microelectronics facility.
u-blox announced the ALEX-R5, a miniature cellular module that integrates low power wide area (LPWA) connectivity and global navigation satellite system (GNSS) technology into an ultra-small systemin-package (SiP) form factor.
