Articles Tagged with ''demo''

Morse Micro announced the first live demonstration of Wi-Fi CERTIFIED HaLow technology extending 3 km.

Richardson RFPD Inc. announces its attendance and participation at the 2016 IEEE MTT International Microwave Symposium (IMS), the premiere international gathering for all aspects of microwave theory and practice. The IMS2016 is the largest RF/Microwave commercial exhibition in the world, with more than 600 exhibiting companies. It is held in conjunction with the IEEE RFIC and ARFTG conferences.

On March 22, individuals with a vested interest in the reliability, affordability and innovative uses of mobile Internet connectivity, will gather at the Dynamic Spectrum Sharing Summit + Demo at the Las Vegas Convention Center to discuss new models for spectrum utilization.The event will be held in conjunction with IWCE 2016, which is scheduled to take place March 21-25, 2016.

RADX Technologies will demo the LibertyGT 1211B COTS, modular, multifunction software defined synthetic instrument (SDSI) at IEEE IMS 2015, Booth # 310.

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance analog RF, microwave and optical semiconductor products, will showcase the industry’s broadest and most advanced Gallium Nitride (GaN) RF product portfolio at IMS2015 in Phoenix, Ariz., May 19-21. MACOM’s booth will feature new, revolutionary Gen 4 GaN on Silicon product solutions optimized for commercial, industrial, scientific and medical applications.

Anritsu Co. announced it will feature a sophisticated, cloud-based connected car system for fleet tracking developed by the University of Hertfordshire in the UK using Anritsu network simulation technology in its stand (Hall 6/6F40) at Mobile World Congress 2015 (MWC), to be held March 2-5 in Barcelona.

TE Connectivity (TE) is featuring its latest high-performance electronic connectivity products and technologies designed for the space environment at the 29th National Space Symposium.

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials, will exhibit at the upcoming DesignCon 2013 conference and exhibition, January 29-30, 2013 at the Santa Clara Convention Center in Santa Clara, California. DesignCon is one of the Printed Circuit Board (PCB) industry’s premier events to learn about the latest advanced products, technologies and developments in the market.