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IDTechEx's recent report, "Advanced Semiconductor Packaging 2025-2035: Forecasts, Technologies, Applications," delves deep into understanding the technical aspects of packaging technologies, examining industry challenges, the progress made by leading companies and providing market forecasts for the sector.
IDTechEx's report, "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications," goes into detail about emerging technologies, including 2.5D and 3D packaging.
Molex, a leading global manufacturer of electronic solutions, announced the acquisition of Interconnect Systems Inc. which specializes in the design and manufacture of high density silicon packaging with advanced interconnect technologies.
RJR Polymers, a leading developer of high performance liquid crystal polymer (LCP) Air Cavity semiconductor packaging (ACP), announced that it has changed its name to RJR Technologies Inc. The new name reflects the company’s growing role as a leading developer and high volume manufacturer of high performance LCP Air Cavity plastic packaging for RF and microwave applications. The company will begin operating under its new name and form a new website, www.rjrtechnologies.com, immediately.
Promex Industries, in the heart of Silicon Valley, recently acquired Quik-Pak, located in Southern California. Quik-Pak specializes in air cavity QFN assembly for MW/RF applications. Visit Quik-Pak/Promex Industries at EuMW, September 6-11, 2015, Palais des Congres in Paris, France, Stand 115
Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs) and Semico Research, a semiconductor marketing and consulting research company, announced that they have teamed up to launch Boards, Chips and Packaging: Designing to Maximize Results. This new industry event will span the system-level ecosystem to address the roles of system architecture, board design, chip design, package design and final fabrication and assembly processes for hardware product development.
TJ Green Associates LLC announced it will be offering a three day microwave packaging technology course at the Holiday Inn Conference Center, Boxborough, Mass., May 6-8th, 2015.
IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies.
RJR Polymers, a leading developer of high performance liquid crystal polymer (LCP) Air Cavity semiconductor packaging (ACP), announced that it has changed its name to RJR Technologies Inc. The new name reflects the company’s growing role as a leading developer and high volume manufacturer of high performance LCP Air Cavity plastic packaging for RF and microwave applications. The company will begin operating under its new name and form a new website, www.rjrtechnologies.com, immediately.
TJ Green Associates will be offering a one-day LTCC Packaging Technology course at the NATEL Ceramic Plant in Carlsbad, Calif. on October 9, 2014.