Articles Tagged with ''indium''

Indium Corp. announces that Glen Thomas has been named product manager for PCB assembly solder paste.  

Indium Corp. introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium’s unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.

Indium Corp. will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany. 

Indium Corp. announces the promotion of two technical managers in the company’s Asia-Pacific operations.

Indium Corp. introduces a new, high-reliability, low-voiding flux coating for solder preforms. LV1000 reduces false failures while increasing productivity, throughput yields, and component performance. This new halide-free (ROL0) material is especially suited for assembly processes in which the components don’t allow for proper outgassing of volatized flux.