Articles Tagged with ''laminate''

Rogers Corp. Advanced Circuit Materials Division launched next generation RO4360G2™ laminates with improved thermal reliability for higher UL MAXIMUM OPERATING TEMPERATURES (MOTs).

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials, will exhibit at the upcoming DesignCon 2013 conference and exhibition, January 29-30, 2013 at the Santa Clara Convention Center in Santa Clara, California. DesignCon is one of the Printed Circuit Board (PCB) industry’s premier events to learn about the latest advanced products, technologies and developments in the market.

StratEdge Corp., a designer and producer of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, introduces a new family of high power laminate packages at IMS2012 Booth #1625. The LL family of leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC).

Rogers Corp. will be highlighting two of its leading printed-circuit-board (PCB) laminate materials for commercial and military satellite-communications (satcom) electronic applications at the upcoming Satellite 2012 Exhibition. 

Rogers Corp. will be highlighting two of its leading printed-circuit-board (PCB) laminate materials for commercial and military satellite-communications (SATCOM) electronic applications at the upcoming Satellite 2012 Exhibition.