Articles Tagged with ''material''

Garlock has announced the launch of WP204, low loss dielectric material with a Dk of 20.4 and a Df of 0.010. 

Indium Corp. has released IndiOx™ (In₂O₃) for use in the manufacture of ITO sputtering targets for thin-film coating.

Researchers from North Carolina State University and the U.S. Army Research Office have developed a way to integrate novel functional materials onto a computer chip, allowing the creation of new smart devices and systems.

 The High Performance Foams Division of Rogers Corp. has officially changed its name to Elastomeric Material Solutions to better reflect the growing range of products and capabilities available to meet customer needs. 

Metallized Carbon Corp., a global leader in the manufacture of oil-free, self-lubricating, carbon-graphite materials for severe service lubrication applications, announces that it produces Silver Metcar, a silver impregnated, carbon-graphite material useful for electrical applications that require low resistance, low voltage drop and low electrical noise.

SANTIER will be presenting their CTE matching high thermal conductivity metals and ceramic packages at IMS2015 in Phoenix, Ariz., May 17-22.

 Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs), announced the introduction of IS350MD that expands its portfolio of halogen-free laminates and prepregs for high-end mobile applications. IS350MD fits nicely between Isola’s well-established standard dielectric constant (Dk) material, DE156, and the company’s ultralow Dk material, IS300MD, which was introduced in 2014 and quickly gained momentum in the High Density Interconnect (HDI) market. 

Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer printed circuit boards (PCBs, announced the introduction of Chronon™, the company’s latest ultra-low loss, high-speed laminate and prepreg materials engineered to mitigate skew issues in high-speed designs that have differential pairs. The introduction of Chronon, which follows the 2014 launch of Gigasync®, expands the company’s portfolio of PCB materials to mitigate skew in high-speed designs.

Rogers Corp., will be promoting its industry-leading printed circuit board (PCB) materials at the IPC APEX EXPO, February 24-26, 2015 at the San Diego Conference Center in San Diego, California.