Articles Tagged with ''RF''

 Analog Devices, Inc. released the industry’s first software-defined radio (SDR) rapid prototyping kit with dual 2 x 2 AD9361 RF transceivers to simplify and rapidly prototype 4 x 4 multiple-input multiple-output (MIMO) wireless transceiver applications on the Xilinx® Zynq®-7000 All Programmable SoC development platforms. 

 Ethertronics Inc., a leading technology company enabling innovative antenna and RF system solutions to deliver the best connected experience, announced the appointment of Vahid Manian as chief operating officer. I 

 Custom Interconnects, LLC announced the release of the most detailed RF characterization conducted to-date on their flagship Fuzz Button® technology platform. 

Texas Instruments announced the addition of the RF Software Development Kit (RFSDK) to its Base Station SoftwarePac, enabling small cell developers to configure the baseband-to-radio communication and achieve first call or system verification in just one day compared to the weeks or months it took previously. With the new RFSDK, TI's KeyStone™- based TCI6630K2L small cell System-on-Chip (SoC) and TCI6631K2L backhaul SoC can now seamlessly implement digital radio functions like digital pre-distortion (DPD) and crest factor reduction (CFR), and use a JESD204B interface to communicate with TI's analog front end transceiver, the AFE7500, to maximize performance and system power efficiency. 

Analog Devices, Inc. introduced new highly integrated RF ICs that greatly simplify the design and reduce the development cost of multi-band base stations and point-to-point (PtP) radios. These new devices include the ADRF6720 I/Q modulator, ADRF6820 I/Q demodulator and ADRF6612 dual-mixer. The highly integrated devices enable the design of base station and high-performance radios requiring multi-band support, high dynamic range and wide channel bandwidths. These products are ideal for designs for 3G/4G communication, microwave PtP radios, military/aerospace and instrumentation applications. ADI’s new RF ICs offer the same performance as radio designs based on a combination of discrete solutions, yet in a significantly smaller form factor. The new devices feature an embedded low phase noise synthesizer, RF switch and balun, digital step attenuator (DSA) and programmable linearity optimization.

RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced the release of the RFVA0016 — a highly integrated one-quarter watt (1/4W) analog-controlled variable gain amplifier (VGA).

RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced that company executives are scheduled to present at the 2012 Stephens Inc. Spring Investment Conference in New York, NY on Wednesday, June 6, 2012, at 9:00 a.m. Eastern Time.

Horizon House has announced plans to launch the inaugural Electronic Design Innovation Conference (EDI CON 2013) in Beijing, China in March 2013 that will focus on design concepts and techniques of RF, microwave and high-speed digital components and systems in China

RF Micro Devices, Inc. announced that company executives are scheduled to present at the 2012 Barclays Capital Global Technology, Media And Telecommunications Conference in New York, NY on Tuesday, May 22, 2012, at 10:15 a.m. Eastern Time.

The Microwave & RF Exhibition that took place at Porte de Versailles, Paris from 3 to 5 April showcased products and services in the RF, microwave, wireless and fibre optic sectors.