Articles Tagged with ''film''

NuSil Technology LLC (http://www.nusil.com), a formulator and manufacturer of silicone compounds for the aerospace, aircraft, electronics and photonics industries, announces the release of CV-2681-12, an electrically conductive, controlled volatility (low outgassing) film adhesive designed for a wide range of applications, from tacking down wires to working with solar cells and mirrors.

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.

Rogers Corp. and representatives of its Advanced Circuit Materials Division will be at the upcoming 2012 IEEE International Microwave Symposium (IMS) to help attendees learn more about Rogers’ wide range of high frequency circuit materials.