Articles Tagged with ''Chipsets''

 Anritsu Co. announces a cost-effective end-to-end solution for testing devices and chipsets supporting enhanced Multicast Broadcast Multimedia Service (eMBMS) for LTE Broadcast that incorporates EXPWAY’s e-Cast™ Broadcast Multicast Service Center server with the Anritsu MD8430A signaling tester and Rapid Test Designer.  

Annual wireless connectivity chipset shipments across Bluetooth, Wi-Fi, NFC, GPS, and ZigBee show no sign of slowing down, reaching almost nine billion annual shipments in 2019, finds ABI Research. Had it not been for combo chipsets and integrated platforms the number of chipsets shipped would have been even higher. Cumulative chipset shipments from 2010 through 2014 will have reached over 21 billion; during the next five years from 2015 to 2019, cumulative shipments will almost double to over 39 billion. “That is over 60 billion wireless connectivity chipsets that will have shipped over the ten year span from 2010 to 2019, driven by the emergence of new device types,” said research director Philip Solis. “There is constant change in the wireless connectivity space across wireless connectivity technologies, versions of technologies, and levels of integration at the same time.”

With over 2.6 billion chipsets expected to ship during 2014, Wi-Fi is currently the most ubiquitous wireless connectivity technology for Internet access. As the technology continues to adapt and expand with new protocols such as 802.11ac, 802.11ax, 802.11ad (WiGig), and Wi-Fi Direct, nearly 18 billion more chips will ship cumulatively from 2015 to 2019.

National Instruments announced that it is the first vendor to execute a Manufacturing Test License (MTL) agreement with Broadcom Corp. The MTL agreement authorizes NI to provide manufacturing test solutions and modifiable application source code to Broadcom® wireless LAN and Bluetooth device customers.

The growth of 802.11ac and 802.11ad will occur in very different ways.  802.11ac will explode into devices, including smartphones, from the start while 802.11ad will see a more modest and staggered growth.  802.11ac is being pushed into smartphones by key carriers’ device requirements that are in sync with 802.11ac hotspot plans for more robust Wi-Fi offloading.

RFMD will be exhibiting at IMS 2013 at booth 730. Explore the RFMD® industry-leading RF and microwave product portfolio with kiosks featuring solutions for WiFi and smart energy, wireless infrastructure, GaN RF power, and microwave MMICs.

The market for chipsets containing LTE baseband processors has ramped up quickly, and is fraught with competition. 15 companies offer over 35 chipsets with LTE, from singlemode LTE chipsets to multimode chipsets integrated with application processors and wireless connectivity. ABI Research’s latest Competitive Assessment ranked Qualcomm first in LTE baseband product features and other attributes, followed by ST-Ericsson and Sequans.

M/A-COM Technology Solutions Inc., a leading supplier of high performance analog semiconductor solutions, is showcasing a broad portfolio of new products for Networks, Aerospace and Defense, and Multi-Market applications at European Microwave Week (EuMW) 2012.  Product solutions on display in M/A-COM Tech’s booth #421 include:

The total market for standards-based wireless connectivity chipsets is expected to exceed $10 billion in 2012, this includes both standalone and combo chipsets that use Bluetooth, Wi-Fi, GPS, NFC, UWB, and ZigBee. “The market continues to develop with technologies - particularly Bluetooth and Wi-Fi - squaring up for a fight to be the dominant standard,” commented Peter Cooney, wireless connectivity practice director.