Articles Tagged with ''circuits''

Agile Microwave Technology Inc., has passed the rigorous standards for quality management systems to earn certification to ISO standard, ISO 9001:2008 for the design and manufacture of RF and microwave circuits, hybrids, modules, MCMs, multi-function modules and MMIC assemblies.

Anokiwave Inc., an innovative company providing highly integrated core IC solutions for mmW and AESA markets, announced the latest addition to its leadership team with the appointment of Andrew Crofts to the position of vice president of Applications. This appointment supports Anokiwave’s plans to extend product development by supporting new customers and applications for its portfolio of mmW products scheduled to release this fall.

Metrigraphics addresses market requirements for tactical, critical communications with several circuit manufacturing and process solutions. Attendees at IMS2015 in Phoenix, Ariz. saw many of these offerings firsthand at the company's booth # 3312.

 As today's battlefield gets more and more tactical, critical communications have never been more important. And as radios and subsystems are being pushed to become smaller and even more ruggedized, it’s causing a chain reaction right down to the circuit level. Where once rigid and thick film technologies were primary go-to solutions, today's military communication applications are requiring antennas to be even more flexible, circuits to fit into tighter spaces, and signal integrity at higher frequencies to be perfect. And to add to that, today soldiers’ vital signs are as closely monitored as a radar screen — it’s easy to understand the push towards advanced circuitry is tasking traditional thinking. 

Cascade Microtech Inc. announced Velox 2.0, the latest version of their probe station control software. Combining the ease of Nucleus™ with the power of ProberBench™, Velox 2.0 delivers new levels of test and measurement efficiency to accelerate time to job completion.

Remtec Inc., a leading manufacturer of substrates and packages using PCTF® (plated copper on thick and thin film) metallization, has applied its time-proven leadless ceramic SMT substrate technology to the development of a new line of standard SMT leadless packages for electro optical circuits matching standard TO-type window lids.

 X-REL Semiconductor, the specialist in high reliability and extreme temperature integrated circuits, has broadened its clock and timing product line by introducing a low-power, small foot-print crystal oscillator driver, XTR60010. 

Metrigraphics continues to advance their process for applying metal layers to circuit substrates and to polyimide layers on multilayer circuits. The process works for both rigid and flexible circuits. Metallization layers can range in thickness from 10 microns to over 100 microns. Substrates can range up to 12" x 12" or 144 square inches.

 eSurface® Technologies, the developer of the eSurface proprietary process for printed circuit boards, announced the appointment of Judy Warner to the eSurface Technologies Advisory Board, effective immediately. 

 Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures, announced it has developed new breakthroughs in processing substrate-based ultra-miniaturized circuits. The additive processes used are an alternative to traditional chemical etching, which causes circuit lines to slope, resulting in performance variations and yield issues.