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DARPA has awarded BAE Systems’ FAST Labs™ research and development organization a $12 million contract as part of the High Operational Temperature Sensors (HOTS) program.
DARPA has awarded BAE Systems’ FAST LabsTM research and development organization a $12 million contract for the Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program.
Raytheon has been awarded a four-year, $15 million contract from DARPA to increase the electronic capability of RF sensors with high-power-density GaN transistors.
Researchers at the Georgia Institute of Technology have developed a new approach to intelligently process that data closer to where it is generated —
on the antenna subarrays themselves.
The Defense Advanced Research Projects Agency (DARPA) has awarded BAE Systems’ FAST LabsTM research and development organization a $14 million contract for the Massive Cross Correlation (MAX) program.
Sivers Semiconductors Inc. has received a U.S.$375,000 award under the Defense Advanced Research Projects Agency (DARPA) Next-Generation Microelectronics Manufacturing (NGMM) program in collaboration with PseudolithIC Inc.
With a focus on the future wave of microsystems innovation, DARPA has selected 11 organizations to begin work on the Next-Generation Microelectronics Manufacturing (NGMM) program.
Raytheon, in partnership with Northrop Grumman Corporation, was awarded a follow-on contract from DARPA to reduce risk for future air-breathing hypersonic systems.
