Articles Tagged with ''wireless''

NXP Semiconductors™ N.V., a worldwide leader in advanced systems solutions for the world’s new virtualized networks, and Bell Labs, the industrial research division of Nokia, announced they are the first to create and demonstrate a universal access device that can be used to combine wireline and wireless access support. The device is capable of supporting wireline (cable, DSL/copper) and wireless (LTE, 5G) standards with a single modem.

M/A-COM Technology Solutions Inc., a leading supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, announced its highly-anticipated MAGb series of GaN power transistors for use in wireless macro basestations. Leveraging MACOM’s Gen4 GaN technology, the new MAGb series is the industry’s first commercial basestation-optimized family of GaN transistors to achieve leadership efficiency, bandwidth and power gain with a linearity and cost structure like LDMOS, and a path to better than LDMOS cost at scaled volume production levels.

Soitec (Euronext), a world leader in manufacturing innovative semiconductor materials and a supplier of wafers for radio-frequency silicon-on-insulator (RF-SOI) applications, has begun mass production of 300-mm RF-SOI substrates for mobile communications.

Qorvo^®, a leading provider of core technologies and RF solutions for mobile, infrastructure and aerospace/defense applications, announced that Qorvo's recently launched RFPA55X2 Wi-Fi power amplifier (PA) family is enabling many of today's leading home and business WLAN networking devices.

Radio Frequency Systems (RFS), a global wireless and broadcast infrastructure specialist, has enhanced its portfolio of passive RF components with an entire suite of new products – 90 in all – to provide a full range of solutions for all wireless in-building commercial and mission-critical communications requirements. New products complement RFS’ comprehensive line of low loss RF feeder cables and jumpersfor DAS and include passive DAS components such as couplers, power splitters, tappers and hybrid combiners.

Anritsu Corp. has announced the availability of three new measurement software packages expanding the functions of the MT8870A Universal Wireless Test Set to support manufacturing tests of IoT/M2M applications.

Qorvo^®, a leading provider of core technologies and RF solutions for mobile, infrastructure and aerospace/defense applications, announced it has expanded its broad portfolio of Wi-Fi products to include new front end modules (FEMs) designed for wireless broadband home gateways and set-top-boxes. Qorvo is an innovator in highly integrated front end modules for Wi-Fi that combine best-in-class performance with up to 3.2 watts of power savings.

The NYU WIRELESS research center announced it will build an advanced programmable platform to rapidly design, prototype, and validate technologies vital for the millimeter wave (mmWave) radio spectrum, which is potentially key to launching the next ultra-high-data-rate generation of wireless communication, or 5G.

Keysight Technologies Inc. announced that the Keysight UXM Wireless Test Set is now fully integrated and supported by WaveStudio, MVG’s OTA dedicated measurement software suite. As an integral part of MVG’s OTA measurement solution, the UXM has been used to provide support for carrier aggregation; an important LTE-A feature that requires advanced test and measurement.

Qualcomm Inc. and TDK Corp. announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore PTE. Ltd.