The Puzzler - June 2010

Semiconductors/ MMICs/ RFICs

Across

3 Largest pure play GaAs foundry (2 words)
8 Class of in-phase, equal power split, N-way power divid- ers combines resistive and reactive dividers (2 words)
9 A fourth metal terminal added to a FET structure and biased to improve device performance by affecting the charge or current flow around the gate area (2 words)
11 Heterojunction bipolar transistor
15 A type of power divider circuit that can achieve isola- tion between the output ports while maintaining a matched condition on all ports
17 Pseudo-metamorphic high electron mobility transistor
19 PCB (3 words)
21 The amount of time it takes for a switch to change state (the measured parameter has reached 90% of its steady- state value) (2 words)
22 Largest GaAs foundry
23 Complementary metal-oxide semiconductor
24 Device technology that integrates HBT and PHEMT de- vices on the same die
25 _____ is the future and always will be

Down

1 A type of transformer that can convert signals that are balanced to signals that are unbalanced and vice versa
2 The current controlling terminal in a FET
4 The ratio of the amplitudes of a single pair of voltage and current waves propagating along the line in the absence of reflections (2 words)
5 Monolithic microwave integrated circuit
6 The amount of time it takes for a switch to settle to a completely changed state after 90% of its value has been reached (2 words)
7 A type of wire bonding that uses a combination of pres- sure, heat and ultrasonic to attach a flat ribbon to a bonding pad (2 words)
10 A specialized electronic package where multiple ICs or other discrete components are packaged onto a unifying substrate (3 words)
12 The contact between a metal and a semiconductor that does not allow carriers to flow in and out of the semicon- ductor (high contact resistance) (2 words)
13 When all devices are tested and the reject die are marked and/or removed so only fully tested, good die are sold/delivered (3 words)
14 The tendency of a high frequency signal to distribute current within a conductor so that the current density near the surface of the conductor is greater than that at its core (2 words)
16 A type of wire bonding that uses a combination of pres- sure, heat and ultrasonic energy to attach a round wire to a bonding pad (2 words)
18 Metal-eptiaxial semiconductor field-effect transistor
20 The contact between a metal and a semiconductor to allow carriers to flow in and out of the semiconductor (low contact resistance) (2 words)