Flomerics’ MicReD subsidiary will play a major role in the recently announced European-funded NANOPACK project, which aims to address thermal barriers to continued performance increases in semiconductors and power electronics by developing new technologies and materials for low thermal resistance interfaces and electrical interconnects.
The NANOPACK consortium, which is coordinated by Thales Research & Technology, will explore systems such as carbon nanotubes, nanoparticles and nano-structured surfaces using different contact-enhancing mechanisms combined with high-volume compatible manufacturing technologies such as electro-spinning. Recent groundbreaking work on nested channel interfaces will be utilized to exploit the beneficial properties of the new materials.
Within the NANOPACK project, MicReD and Budapest University of Technology & Economics (BUTE) will collaborate to create an intelligent micro-scale tester for thermal interface materials enabling thermal resistance measurements with at least one order of magnitude higher accuracy than is possible today. The project results will be disseminated through the organization of yearly public NANOPACK workshops in connection with the existing THERMINIC Workshops.