ASE Group, the world's largest provider of independent semiconductor manufacturing services in assembly and test, has placed significant multiple orders with SUSS MicroTec for its lithography production equipment. The first order packages were booked in October and November and included several production mask aligners and coat/bake/develop clusters for 200 and 300 mm, that will be installed at the company’s wafer level packaging and redistribution process facility in Kaohsiung, Taiwan.

Wafer level packaging is an advanced packaging technology whereby the die and 'package' are manufactured and tested on the wafer, then diced into individually packaged ICs. ASE views 300 mm wafer level packaging technology as vital for continuous improvement in the quality and cost of high technology products.

"Driven by market demands for faster, smarter, portable and integrated electronic products, we are increasingly moving towards more sophisticated semiconductor applications," said D.Y. Chen, vice president of advanced packaging operations, ASE Kaohsiung. "Therefore, we have to rely on production equipment that enables high yields, coupled with unmatched throughput and cost effectiveness. SUSS MicroTec’s product offerings in lithography technology will enhance our success in providing wafer level packaging and wafer bumping services to our customers."

Rolf Wolf, managing director of SUSS MicroTec Lithography Division, replied, “This repeat order from this key customer signals again that SUSS MicroTec’s high volume production spin coaters and mask aligners are setting the industry standards in advanced packaging."