Delivering superior RF performance in high frequency wireless systems, the DB0603N 3 dB 90-degree coupler from AVX Corp. features a miniature 0603 package size and low insertion loss of typically 0.2 dB.
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The couplers suit applications in balanced amplifiers and signal distribution in wireless communications for frequency bands at 3.5, 3.0, 2.4 and 2.14 GHz.
Based on AVX Proprietary RFAP thin-film technology, the couplers deliver low parasitics, leading high-frequency performance, rugged construction for automatic assembly and high power handling of 3 W. RoHS compliant, these miniature devices provide high isolation, amplitude balance of 0.3 dB typical and phase balance of 2 degrees typical.
Land Grid Array (LGA) terminations minimize parasitic inductance, while providing further benefits such as inherent low profile, self-alignment during reflow soldering, excellent solderability and better heat dissipation. Terminations are Nickel with a lead-free solder coating compatible with automatic soldering technologies.
The thin-film silicon dioxide dielectric is much thinner, around 1 μm compared to Low Temperature Co-fired Ceramic (LTCC) of 50 to 250 μm, which enables much higher capacitance density. This by far outweighs the low dielectric constant of thin-film. In addition, the conductors used for the electrodes have lower resistivity (of the order of 1 milliohm per mm square) than LTCC counterparts (10 to 20 milliohms per mm square). This allows for higher RF-power handling.
>RFAP leads to smaller, more precise devices with better RF performance, superior temperature stability, high levels of repeatability, better termination compatibility with SMD processes and flexibility for design engineers.