STMicroelectronics and IBM have signed an agreement to collaborate on the development of next-generation process technology. The agreement includes 32 nm and 22 nm complementary metal-oxide semiconductor (CMOS) process technology development, design enablement and advanced research adapted to the manufacturing of 300 mm silicon wafers. In addition it includes both the core bulk CMOS technology and value added derivative system-on-chip technologies, and positions both companies at the leading edge of technology development. The new agreement will also include collaboration on IP development and platforms to speed the design of system-on-chip devices in these technologies.
As part of the agreement, each company will establish a technical development team at the other company’s facility. For bulk CMOS development, ST will establish a research and development team in IBM’s Semiconductor Research and Development Center in East Fishkill and Albany, New York. At the same time, IBM will establish a research and development team at ST’s 300 mm wafer semiconductor R&D and fabrication facility in Crolles, France, where the two companies will jointly develop a variety of value added derivative technologies, such as embedded memory and analog/RF. These technologies can be broadly applied in consumer and server markets and in wireless applications, such as cell phones and global positioning devices.
STMicroelectronics will join a partnership of semiconductor manufacturing, development and technology companies who collaborate to address the design complexity and advanced process development necessary for producing smaller, faster, more cost efficient semiconductors. Members of this six-company development network, known as the IBM CMOS technology alliance, benefit from early access to technology, the ability to drive technology definition, the combined research and development resources for problem solving and access to a common manufacturing base.
Similarly, IBM and ST will work together to expand the network at ST’s 300 mm wafer semiconductor fabrication facility in France to include other members of IBM’s CMOS technology alliance interested in the development of value added derivative system-on-chip technologies.