HIRAI SK Corp. will feature a foundry service of multi-layered LTCC substrates that targets higher Q, higher dimensional precision and higher yield for RF and millimeter-wave applications.
Fine pitch and high Q substrate with thin film metallization, WLAN FEM with the embedded low loss diplexer and RF components sintered by microwave will be available soon.
HIRAI ships samples in a week after the design freeze and provides RF design support to a substrate with embedded passive components and test service up to 67 GHz. Stop by booth 1824 for more information or visit www.hirai.co.jp.