Because PCBs are fundamental to electronic devices, they are used in a variety of defense, consumer electronics, telecommunications, healthcare and energy and power applications. This widespread adoption creates a significant market opportunity. However, PCB manufacturers and users must address challenges to continue to enable the mass market appeal and unique opportunities envisioned by the market forecasts and the electronics industry. These challenges and their solutions form the basis for the articles in this eBook.
These articles will give the reader a good understanding of the fundamentals and challenges of PCB material selection, design and fabrication that must be addressed to create the solutions that the electronics industry needs to evolve. The first article investigates a new composite laminate material that uses standard/qualified PTFE-based paper and glass fabric layers to provide good dimensional stability and Z-axis CTE while also exhibiting low Dk and Df. The second and last articles look at the fabrication process. The second article offers excellent insight into the fabrication steps and what is necessary at each step to optimize circuit performance. The last article addresses considerations for high-frequency RF and high-speed digital multilayer boards. The third article discusses how new materials overcome the traditional challenges presented by high Dk/low Df materials. The fourth article addresses how to reliably bend and form PCBs in response to the emergence of applications requiring 3D solutions.
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