Nuvotronics revolutionary PolyStrata® Architecture provides an unprecedented platform for mmWave performance, integration, and miniaturization. With 10x - 100x improvement in size, weight, and power (SWaP) Nuvotronics is poised to lead the wave to 5G and beyond. The package can be surface mounted to a PCB using standard SMT processes. This increases the ease of manufacturing while maintaining superior performance in a smaller size compared to other packaging substrates.
