Finwave Semiconductor, Inc. is showcasing its latest technology and products at MWC Barcelona. The company will unveil the newest performance benchmarks with its advanced GaN-on-Si technology and high-power switches targeting the infrastructure and handset markets. Demonstrations will be hosted in Finwave’s meeting room (Hall 2, Booth 2D12MR) on the show floor at Fira Gran Via in Barcelona from February 26-29.

Finwave will present its enhancement-mode (Emode) 200 mm GaN-on-Si transistor technology. Differentiated from conventional depletion-mode (Dmode) GaN technology, Finwave’s Emode RF FETs have less than 1 Ω mm on resistance, low-knee voltage, > 700 mS/mm transconductance and negligible current collapse with power-added-efficiency (PAE) as high as 60 percent and excellent AM-PM performance for operating frequency ranging from 8 to 26 GHz. The technology is capable of operating at Vdd of 5 V or lower, demonstrating its potential for efficient power amplifiers for 6G frequency range 3 (FR3) frequency band (7 to 24 GHz) and FR2 mmWave band infrastructure, CPEs and handset applications.

Furthermore, Finwave will showcase its 3DGaN FinFET technology demonstrating its remarkable linearity improvement capability. Due to its 3D gate geometry, Finwave’s 3DGaN FinFET reduces transistor leakage current, current collapse and knee voltage while improving PAE and linearity over 10 dB compared to conventional GaN transistors. With higher linearity, better PAE and reduced memory effect, 3DGaN FinFET technology is attractive for applications such as massive MIMO with large arrays.

Finwave will also unveil its first family of high-power RF switch products. The RF switch products feature 100 ns fast switching and settling time, broadband operations up to 12 GHz and high-power handling up to 40 W. The combination of broadband operation, fast switching and high-power handling sets it apart from current offerings.

“Finwave is on the cusp of bringing the true potential of GaN to some of today’s most important enabling markets,” said Finwave Semiconductor CEO Dr. Pierre-Yves Lesaicherre. “Our technology has already demonstrated its ability to deliver extremely high performance in higher frequency applications, and the implications of that are very exciting for both infrastructure and handsets. Additionally, we are making strong progress in moving our patented GaN-on-Si technology from the MIT lab to high volume production.”

Innovating with cutting-edge GaN technology, Finwave continues to push the boundaries of performance and efficiency, driving forward the evolution of telecommunications and connectivity solutions. Visit Finwave's meeting room at MWC Barcelona to witness the future of semiconductor technology firsthand.