Rogers Corp. now offers RO4730G3™ UL 94 V-0 antenna-grade laminates manufactured with standard profile electrodeposited copper foil to meet present and future performance requirements in active antenna arrays and small cells, notably in IoT applications as well as emerging 5G wireless systems. With the option of multiple copper foil offerings, design flexibility increases and rounds out the performance versus cost portfolio.

RO4730G3 ceramic hydrocarbon laminates were originally introduced with a standard profile low-loss LoPro® copper foil option. While LoPro copper foil provides excellent passive-intermodulation (PIM) performance (typically better than -160 dBc) and has gained popularity for intermodulation (IM) sensitive, high frequency antennas, as 5G designs evolve, PIM has become less important on some applications.  RO4730G3 laminates with standard profile electrodeposited copper provide an optimum blend of price, performance, and durability.

RO4730G3 laminates provide the low dielectric constant (Dk) of 3.0 favored by antenna designers, held to a tolerance of ±0.05 through the thickness (z axis) when measured at 10 GHz. These laminates are 30 percent lighter than PTFE circuit materials and feature a high glass transition temperature (Tg) of better than +280°C for compatibility with automated assembly techniques. RO4730G3 circuit laminates exhibit low z-axis coefficient of thermal expansion (CTE) of 30.3 ppm/°C from -55 to +288°C for reliable plated through holes (PTH) in multilayer circuit assemblies and are lead-free-process compatible.