Indium Corp. has launched InFORMS® ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications.
Indium’s InFORMS® ESM02 is a reinforced solder fabrication that produces a high-reliability solder joint with increased thermal and mechanical performance.
Until recently, InFORMS® technology was only applied at the baseplate level. New production capabilities have expanded its use to the die-level with a bondline of 50μm. Other benefits of InFORMS® include:
- Drop-in replacement for other bondline control methods
- Increased lateral strength
- Bondline co-planarity
- Improved thermal cycling reliability
- Available in ribbon and preforms