The latest release of NI AWR Design Environment, V13, will be on display at the Electronic Design Innovation Conference (EDI CON) 2017, being held
in Shanghai, China on April 25-27. In addition to software demonstrations within NI Booth #311, the NI AWR software product portfolio will be featured in one 40-minute workshop and two 20-minute technical sessions. NI AWR software activities during EDI CON include:
Demonstrations in Booth #311:

  • What’s New in NI AWR Design Environment V13
  • Microwave Office for MMIC, RF PCB and Module Design
  • Visual System Simulator™ for Wireless Communications and Radar Systems
  • Analyst™ and AXIEM Electromagnetic (EM) Technology for Interconnect Analysis
  • AntSyn™ for Antenna Synthesis/Optimization

Technical Presentations
Multi-Technology Module Design Workshop

Related Resources

KYOCERA AVX WBR Series of Thin Film Wire Bond Resistors
Sunstream Global Technologies
  • Design Flow and Simulation Technologies Supporting Multi-Technology RF Modules for Wireless Applications
  • Wednesday, April 26, 3:35 p.m., Room #305B

EM/Circuit Co-Simulation Session

  • EM/Circuit Co-Simulation of T/R Front-End Modules and Actively-Scanned Antenna Arrays
  • Tuesday, April 25, 1:25 p.m., Room #307A

Phased-Array Antenna Session

  • Modeling Large Phased-Array Antenna Systems With an Advanced Behavioral Model and Simulated/Measured Radiating Elements
  • Tuesday, April 25, 2:40 p.m., Room #307A

For more information, visit awrcorp.com/news/events/event/edicon-china-2017.